| liitintä: | Screwless - Leg Spring, Push-In Spring |
|---|---|
| lankatulkki: | 12-28 AWG |
| Jännite: | 250V |
| Vääntömomentti - Ruuvi: | - |
| Sarja: | HM |
| Ruuvikierre: | - |
| Ruuvi Material - Pinnoitus: | - |
| Positiot Per Level: | 7 |
| Piki: | 0.400" (10.16mm) |
| Pakkaus: | Bulk |
| Käyttölämpötila: | -40°C ~ 115°C |
| Lukumäärä tasot: | 1 |
| Asennustyyppi: | Through Hole, Press-Fit |
| Kiima Suunta: | Vertical with Board |
| Kotelon materiaali: | Thermoplastic |
| ominaisuudet: | Interlocking (Side) |
| nykyinen: | 8A |
| Ota Material - Pinnoitus: | Brass - Tin Plated |
| Väri: | Gray |
| Clamp Materiaali - Pinnoitus: | Steel, Stainless |
HM07808100J0G
1000 TB SP CLA PRESS FIT
HM0787-100
FERRITE EMI DISC 20MM X 1.27MM
HM07708000J0G
500 TB SP CLA DIP SOLDER
HM07708100J0G
500 TB SPR CLA PRESS FIT
HM07408000J0G
762 TB SP CLA DIP SOLDER
HM07608000J0G
1016 TB SP CL DIP SOLDER
HM07508000J0G
508 TB SP CLA DIP SOLDER
HM07408100J0G
762 TB SPR CLA PRESS FIT
HM07508100J0G
508 TB SPR CLA PRESS FIT
HM07808000J0G
1000 TB SP CL DIP SOLDER
SIT8209AI-21-28E-166.666000Y
-40 TO 85C, 3225, 20PPM, 2.8V, 1
SIT8208AI-8F-25E-72.000000Y
-40 TO 85C, 7050, 10PPM, 2.5V, 7
SIT8209AI-3F-33S-133.333330Y
-40 TO 85C, 5032, 10PPM, 3.3V, 1
SIT3907AI-23-33NZ-74.175000T
OSC DCXO 74.1750MHZ LVCMOS LVTTL
SIT3808AI-D2-33EG-31.250000Y
OSC MEMS VCXO 31.2500MHZ LVCMOS
SIT8209AC-3F-28S-148.351648X
-20 TO 70C, 5032, 10PPM, 2.8V, 1
SIT8209AI-8F-28S-166.660000T
-40 TO 85C, 7050, 10PPM, 2.8V, 1
501HCA12M0000BAG
OSC CMEMS 12.000MHZ LVCMOS SMD
DSC1001CI5-070.4550T
OSC MEMS 70.445MHZ CMOS SMD
DSC1003DL5-100.0000T
OSC MEMS 100.000MHZ CMOS SMD
