| Leveys: | 0.280" (7.11mm) |
|---|---|
| Tyyppi: | Fingerstock |
| Muoto: | - |
| Sarja: | - |
| Pinnoitus - Paksuus: | 299.21µin (7.60µm) |
| plating: | Tin |
| Käyttölämpötila: | 121°C |
| materiaali: | Beryllium Copper |
| Pituus: | 16.000" (406.40mm) |
| Korkeus: | 0.110" (2.79mm) |
| kiinnitystapa: | Adhesive |
0C97052019
AP COIL NIB PSA
0C97054102
NOSG COIL BF PSA
0C97054001
AP COIL BF
0C97054216
NOSG COIL ZNY PSA
0C97052117
NOSG COIL SNB PSA
0C97054019
RFI EMI GROUNDING MATERIAL 25FT
0C97053802
AP COIL BF PSA
0C97054117
NOSG COIL SNB PSA
0C97054202
NOSG COIL BF PSA
0C97054002
RFI EMI GROUNDING MATERIAL 25FT
PFRR0603Y1000WBT
RES SMD 100 OHM 0.05% 1/10W 0603
M55342E06B3B24RWI
RES SMD 3.24KOHM 0.1% 0.15W 0805
Y1624191R000Q9W
RES SMD 191 OHM 0.02% 1/5W 0805
Y1624499R000T9R
RES SMD 499 OHM 0.01% 1/5W 0805
Y40233K90000T9W
RES SMD 3.9K OHM 0.01% 0.3W 1206
Y112110K0000A0L
RES SMD 10K OHM 0.16W J LEAD
Y406315K0000Q0W
RES SMD 15K OHM 0.02% 1/2W 1206
Y08500R01000F0R
RES SMD 0.01 OHM 1/2W 2516 WIDE
Y17461K00000Q0R
RES SMD 1K OHM 0.02% 0.6W J LEAD
Y16242K61000T9W
RES SMD 2.61KOHM 0.01% 1/5W 0805
