| Käyttö: | Sheet |
|---|---|
| Paksuus: | 0.0050" (0.127mm) |
| Terminen Ominaisvastus: | - |
| Lämmönjohtokyky: | 1.8 W/m-K |
| Muoto: | Rectangle |
| Sarja: | Ti900 |
| ääriviivat: | 105.00mm x 27.00mm |
| materiaali: | Silicone |
| Väri: | White |
| Tausta, Carrier: | Viscose |
| tarttuva: | Adhesive - One Side |
TI900-10-10-0.12
THERMAL PAD 10X10X0.12MM
TI900-20-10-0.12
THERMAL PAD 20X10X0.12MM
TI900-19.50-12.70-0.12
THERMAL PAD 19.5X12.7X0.12MM
TI900-10-50-0.12
THERMAL PAD 10X50X0.12MM
TI900-20-20-0.12
THERMAL PAD 20X20X0.12MM
TI900-144.4-38-0.12
TI900 144.4X38X0.12MM
TI900-150-150-0.12-0
TI900 SHEET 150X150X0.12MM
TI900-100-100-0.12-0
TI900 SHEET 100X100X0.12MM
TI900-105-37-0.12
TI900 105X37X0.12MM
TI900-100-100-0.12
TI900 100X100X0.12MM
8N4QV01KG-0081CDI
IC OSC VCXO QD FREQ 10CLCC
8N4QV01EG-0128CDI
IC OSC VCXO QD FREQ 10CLCC
8N4QV01EG-0023CDI
IC OSC VCXO QD FREQ 10CLCC
8N4QV01KG-1105CDI
IC OSC VCXO QD FREQ 10CLCC
8N3QV01FG-0148CDI
IC OSC VCXO QD FREQ 10CLCC
X1288V14Z-2.7
IC RTC CLK/CALENDAR I2C 14-TSSOP
PT7C4372AWE
DIGITAL CLOCK PRECISION ADJUSTME
DS17485S-5
IC RTC CLK/CALENDAR PAR 24-SOIC
CDP68HC68T1M2Z
IC RTC CLK/CALENDAR SPI 16-SOIC
M48T128Y-70PM1
IC RTC CLK/CALENDAR PAR 32-DIP
